To provide an insulating sheet and a laminated structure high in handleability at a non-cured state, and capable of obtaining a cured object with a low relative dielectric constant.
The insulating sheet contains a polymer with the weight average molecular weight of 10,000 or larger, a curing compound equipped with an epoxy group or an oxetane group, a cyanate compound with a cyanate equivalent of 50 to 200 and having a cyanate group, a curing agent, and a filler. The laminated structure 1 is provided with a substrate 2 at least having a first conductive layer 2b on one of faces and a through-hole or a concave part on one of faces, insulating layers 3, 4 laminated on one or both faces of the substrate 2, and second conductive layers 5, 8 laminated on a face at an opposite side of the face where the substrate 2 of the insulating layers 3, 4 are laminated or a circuit board. The insulating layers 3, 4 are formed by curing the insulating sheet.
MAENAKA HIROSHI
AOYAMA TAKUJI
KUSAKA YASUNARI
INOUE TAKANORI
KONDO SHUNSUKE
YAMADA YU
WATANABE TAKASHI
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