To provide an insulating sheet and a laminated structure high in handleability at a non-cured state, and capable of obtaining a cured object with a low relative dielectric constant.
The insulating sheet contains a polymer with the weight-average molecular weight of 10,000 or larger, a curing compound with a vinyl benzyl ether group, a curing agent and a filler. The laminated structure 1 is provided with a substrate 2 having a first conductive layer 2b at least on one of its faces and either a through-hole or a concave part on one of the faces, insulating layers 3, 4 laminated on one or both faces of the substrate 2, and second conductive layers 5, 8 laminated on a face opposite to the face of the substrate 2 laminated with the insulating layers 3, 4 or a circuit board. The insulating layers 3, 4 are formed by curing the insulating sheet.
MAENAKA HIROSHI
AOYAMA TAKUJI
KUSAKA YASUNARI
INOUE TAKANORI
KONDO SHUNSUKE
YAMADA YU
WATANABE TAKASHI
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