Title:
INSULATION ADHESIVE FOR MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH1046131
Kind Code:
A
Abstract:
To obtain an interlaminar insulation epoxy resin adhesive which has flame retardancy and excellent storage stability and can rapidly cure at a temperature as high as 100°C or above.
This adhesive essentially consists of a brominated bisphenol epoxy resin or brominated phenoxy resin (A) having a degree of modification of 20% or above and a weight-average molecular weight of 10,000 or above, a bisphenol epoxy resin (B) having an epoxy equivalent of 500 or below and an epoxy resin curing agent. The amount of A should be 55-90wt.% based on the total weight of A and B.
Inventors:
KISHI TOYOAKI
HOZUMI TAKESHI
HONJIYOUYA TOMOMI
NAKAMICHI SEI
HOZUMI TAKESHI
HONJIYOUYA TOMOMI
NAKAMICHI SEI
Application Number:
JP20381896A
Publication Date:
February 17, 1998
Filing Date:
August 01, 1996
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G59/40; C08L63/00; C09J163/00; H05K3/46; (IPC1-7): C09J163/00; C08G59/40; C09J163/00; H05K3/46