Title:
INSULATION MATERIAL MOLDING DEVICE AND INSULATION MATERIAL MOLDING METHOD
Document Type and Number:
Japanese Patent JP2016016418
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain an insulation material molding device that can shorten mold exchanging time and temperature rise time of a mold and has high-production efficiency.SOLUTION: An insulation material molding device 1 includes: a bendable lower mold 6 in which multiple strip-shaped molding plates 5 are arranged so that respective long sides thereof are positioned proximately one another in series; and means for pressing from above with respect to the lower mold 6.SELECTED DRAWING: Figure 4
Inventors:
IKUNO HIROKAZU
NISHIZAKI HIDEKAZU
NISHIZAKI HIDEKAZU
Application Number:
JP2014139671A
Publication Date:
February 01, 2016
Filing Date:
July 07, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B30B9/00; B29C51/08; B29C51/30; B30B15/02
Attorney, Agent or Firm:
Tadahiko Inaba
Kanako Murakami
Shigeaki Matsui
Kuratani Yasutaka
Kanako Murakami
Shigeaki Matsui
Kuratani Yasutaka