To provide a resin-bearing metal foil which is excellent in dielectric characteristics and cracking resistance, and to provide a multilayer printed circuit board.

The resin-bearing metal foil is provided with a resin layer comprising a benzocyclobutene resin and a liquid elastomer. Preferably, a specific styrene-butadiene copolymer should be used as the liquid elastomer. The multilayer printed circuit board is obtained by superposing the resin-bearing metal foil on one surface or each of both surfaces of an internal layer circuit board, followed by heating and pressurizing.