Title:
INTERCONNECTION BOARD
Document Type and Number:
Japanese Patent JP3170429
Kind Code:
B2
Abstract:
PURPOSE: To provide an interconnection board having an insulation film not deteriorative whereas it is made of an organic polymer, in a small number of simple steps at low cost.
CONSTITUTION: An interconnection board 3 is formed on the surface of a base board 2 and comprises at least a thermosetting organic polymer insulation film 6, a conductor film 7 formed on a flat face of the film 6 and via-conductors 8 piercing the film 6. The film 7 is made of a metal not reactive with the film 6 when this film 6 hardens and the conductor 8 is made of a metal other than previous metals.
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Inventors:
Takeshi Ohno
Toshikatsu Takada
Toshikatsu Takada
Application Number:
JP9792095A
Publication Date:
May 28, 2001
Filing Date:
March 29, 1995
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H05K3/46; H05K1/00; (IPC1-7): H05K3/46
Domestic Patent References:
| JP62252994A | ||||
| JP63274199A |
Attorney, Agent or Firm:
Masayuki Yano
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