ION IMPLANTATION DEVICE AND METHOD OF PROCESSING PLURAL WAFERS USING THE SAME

Japanese Patent JP2017037717

A

PROBLEM TO BE SOLVED: To provide a technology of enhancing wafer transport capability in an ion implantation device.SOLUTION: A first transport mechanism 80 and a second transport mechanism 85 transport each pair of two wafers from a wafer container 59 to an alignment device 66 via a buffer device 60. After alignment, the wafers are supplied into a first load lock chamber 53 and a second load lock chamber 54, respectively. An intermediate transport mechanism 90 transports one of the paired two wafers from the first load lock chamber 53 to a vacuum processing chamber 16. After ion implantation processing, the wafer is transported from the vacuum processing chamber 16 to the first load lock chamber 53, and the other one of the paired two wafers is transported from the second load lock chamber 54 to the vacuum processing chamber 16. After ion implantation processing, the wafer is transported from the vacuum processing chamber 16 to the second load lock chamber 54. The first transport mechanism 80 and the second transport mechanism 85 move the two implanted wafers in pair from the first load lock chamber 53 and the second load lock chamber 54, to be stored in the wafer container 59.SELECTED DRAWING: Figure 1

KUDO TETSUYA
EBISU SHINJI
FUJII YOSHITO

JP2015156435A

February 16, 2017

August 06, 2015

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SUMITOMO HEAVY IND ION TECH CO LTD

H01J37/317; H01L21/265; H01L21/677

JPH10135146A	1998-05-22
JP2006156762A	2006-06-15

Sakaki Morishita
Yusuke Murata
Tomoyuki Miki
Tomisho Teruo

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