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Title:
ITO SPUTTERING TARGET AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2003055760
Kind Code:
A
Abstract:

To provide an ITO sputtering target capable of greatly contributing to the reduction of flat panel display manufacturing cost while reducing the increase of abnormal discharge and nodules to a level at which no problem occurs at film deposition.

The ITO sputtering target contains a sintered body having a composition consisting essentially of In, Sn and oxygen and also having ≥99% relative density and a ≥10 mm thick part. Such a target can be obtained, e.g. by treating slurry containing In2O3 and SnO2 using a bead mill and then subjecting the slurry to forming and firing.


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JP2000061917ITO MOLDING AND MANUFACTURE THEREOF AND MANUFACTURE OF ITO SINTERED BODY
WO/2007/142330TRANSPARENT CONDUCTIVE FILM, PROCESS FOR PRODUCTION OF THE FILM, AND SPUTTERING TARGET FOR USE IN THE PRODUCTION OF THE FILM
Inventors:
UCHIUMI KENTARO
NAGASAKI YUICHI
KUROSAWA SATOSHI
Application Number:
JP2001244767A
Publication Date:
February 26, 2003
Filing Date:
August 10, 2001
Export Citation:
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Assignee:
TOSOH CORP
International Classes:
C04B35/457; C23C14/34; (IPC1-7): C23C14/34; C04B35/457
Domestic Patent References:
JP2001072470A2001-03-21
JP2001081551A2001-03-27
JPH09125236A1997-05-13
JPH10182150A1998-07-07
JP2001099789A2001-04-13



 
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