Title:
JET TYPE SOLDERING DEVICE
Document Type and Number:
Japanese Patent JP2000117425
Kind Code:
A
Abstract:
To reduce solder dross generated within a solder bath in a jet type soldering device.
A flow dispersing plate 22 for molten solder 11 is provided in a solder bath 10. A plate surface of the flow dispersing plate 22 is positioned on the surface which extends in the radial direction passing through the central axis of a rotary shaft 15, moreover a minimum gap wherein the inner end edge of the flow dispersing plate 22 is not brought into contact with the rotary shaft 15 is provided between both, and the flow of molten solder 11 around the rotary shaft 15 is dispersed around.
Inventors:
MATSUBARA YOSHIMASA
Application Number:
JP30338698A
Publication Date:
April 25, 2000
Filing Date:
October 08, 1998
Export Citation:
Assignee:
TAISEI KAKEN KK
International Classes:
B23K1/00; B23K1/08; B23K3/06; H05K3/34; (IPC1-7): B23K1/08; B23K1/00; B23K3/06; H05K3/34
Attorney, Agent or Firm:
Takami Teshima
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