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Patent Searching and Data


Title:
JIG FOR SOLDERING AND MOUNTING ISOLATOR, PRODUCTION OF ISOLATOR MOUNT USING THE SAME AND ISOLATOR MOUNT PRODUCED BY USING THE SAME
Document Type and Number:
Japanese Patent JPH10294607
Kind Code:
A
Abstract:

To reduce production costs by facilitating the mutual positioning and soldering of carrier and ferrite substrate when providing an isolator mount.

A jig for soldering and mounting to be used when soldering a ferrite substrate 2 of isolator and a chip resistor 5 onto the carrier is composed of a jig base 20 having a recess for housing and positioning a carrier 1 on its upper surface while being formed from a material which improves heat conductivity and is hardly soldered, and a jig plate 30, which has an opening part for housing and positioning the ferrite substrate 2 at its central part and forms a notched part 35 for forming a solder pool continuously to the set section of chip resistor 5 at its opening peripheral part, formed from a material, which is hardly soldered, and overlapped onto the jig base 20 while being mutually positioned through position engaging elements 25, 31 and 32.


Inventors:
KUNIMOTO TAKUSHI
HAKAMATA SHUJI
KATO MASUO
IKEDA YUTAKA
Application Number:
JP10190797A
Publication Date:
November 04, 1998
Filing Date:
April 18, 1997
Export Citation:
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Assignee:
FUJI ELECTROCHEMICAL CO LTD
International Classes:
H01P1/36; H01P1/387; H01P11/00; H05K3/30; H05K3/34; (IPC1-7): H01P11/00; H01P1/36; H01P1/387
Attorney, Agent or Firm:
Kensuke Isshiki (2 outside)