Title:
DETERMINATION METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2023100573
Kind Code:
A
Abstract:
To detect the occurrence of embedding defects.SOLUTION: A determination method includes steps of performing spectroscopic measurement on a substrate in which a pattern including recesses is formed and an embedding material is embedded in the recesses, and measuring an absorbance spectrum of the substrate in which the embedding material is embedded, and determining the embedded state of the recess on the basis of the integrated value of the intensity at a plurality of wavenumbers of the measured absorbance spectrum of the substrate.SELECTED DRAWING: Figure 14
Inventors:
UEDA HIROICHI
ASANO MASASHI
KAITSUKA TAKANOBU
OTSUKI YUJI
UMEHARA YASUTOSHI
ASANO MASASHI
KAITSUKA TAKANOBU
OTSUKI YUJI
UMEHARA YASUTOSHI
Application Number:
JP2022130653A
Publication Date:
July 19, 2023
Filing Date:
August 18, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/66; C23C16/505; H01L21/31
Attorney, Agent or Firm:
Sakai International Patent Office