To improve thinning and manufacturability of a key switch, and to improve a click feeling in the key switch while reducing cost, by improving the click feeling in the key switch without adding a new part and a new mechanism.

A circular projection part 18a is formed on a reverse surface of a fixing sheet 12 by a pressure sensitive adhesive layer, and a nonadhesive surface 19 having no pressure sensitive adhesive layer is annularly formed on its outer periphery, and a board pressure sensitive adhesive layer 18b is also formed on the nonadhesive surface 19 by the pressure sensitive adhesive layer. A domed contact point spring 14 is fixed to the fixing sheet 12 by adhering its apex part to the projection part 18a. The board pressure sensitive adhesive layer 18b is adhered to a surface of a printed wiring board 13 by superposing the contact point spring 14 on the printed wiring board 13 provided with contact point parts 15a and 15b, and the printed wiring board 13 and the fixing sheet 12 are integrated.