Title:
A LED device which has a laminate sheet using a silicone resin constituent and the constituent, and the laminate sheet
Document Type and Number:
Japanese Patent JP6072662
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a silicone resin composition that gives a cured product having excellent characteristics such as adhesion strength, heat resistance, and weather resistance.SOLUTION: The silicone resin composition comprises: (A) an unsaturated group-containing organopolysiloxane; (B-1) a hydrosilyl group-containing organopolysiloxane and (B-2) a linear organopolysiloxane having a hydrosilyl group on both terminals, in an amount that results in a molar ratio of 0.1 to 4.0 of hydrogen atoms bonded to silicon atoms in (B-1) component and (B-2) component to the sum of monovalent unsaturated hydrocarbon groups in (A) component; and (C) a platinum group metal catalyst in an effective amount.
Inventors:
Akabane Saiko
Shigeo Yamaguchi
Tsutomu Kashiwagi
Shigeo Yamaguchi
Tsutomu Kashiwagi
Application Number:
JP2013213175A
Publication Date:
February 01, 2017
Filing Date:
October 10, 2013
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/07; C08G77/12; C08G77/20; C08J5/24; C08K9/06; C08L83/05; H05K1/03
Domestic Patent References:
| JP2010001336A | ||||
| JP2010089493A | ||||
| JP2011127074A | ||||
| JP2013095862A |
Foreign References:
| WO2013077703A1 |
Attorney, Agent or Firm:
Mikio Yoshimiya
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