Title:
NITROGEN REFLOW EQUIPMENT
Document Type and Number:
Japanese Patent JP3191415
Kind Code:
B2
Abstract:
PURPOSE: To prevent a chip mounted on the lower surface of both sided mounting substrate from being applied with thermal damage through reheating.
CONSTITUTION: Heat exchanging pipes 22 are prepared under a transfer conveyer 4 for substrates 10 in a heating chamber 1, and an air feeding means for feeding air among the pipes 22 and a shuttering means 23 for isolating the conveyer 4 and the pipes 22 are provided as well. Thus the lower space under the conveyer 4 can be kept at a low temperature, resulting in giving no thermal damage to a chip 9 on the lower surface of the substrate 10 through excessive heating.
Inventors:
Satoshi Tanaka
Application Number:
JP17399292A
Publication Date:
July 23, 2001
Filing Date:
July 01, 1992
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K3/34; B23K1/008; (IPC1-7): H05K3/34; B23K1/008
Domestic Patent References:
| JP6411396A | ||||
| JP446667A | ||||
| JP63165069A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)