To obtain a laminate wherein an yttria stabilizing zirconia layer with a (100) surface and a Pt film with a (100) surface are deposited in order on a silicon substrate with a (100) surface by orienting the silicon substrate, the yttria stabilizing zirconic layer, and the Pt film in specified directions.

A silicon substrate 1 with a (100) surface is used. The (100) surface of the silicon substrate is thermal-etched to have a rough surface. Next, an yttria stabilizing zirconia(YSZ) sintered body is set in a vacuum evaporation apparatus, which is reduced to high vacuum. Then, an electron beam is cast on the YSZ sintered body to evaporate a YSZ layer 2 on the silicon substrate with the (100) surface. Thereafter, the substrate 1 formed with the YSZ film 2 is set in a sputtering apparatus, wherein Pt is used for the target material and Ar is used for a sputtering gas. The pressure of the apparatus is adjusted to 0.4 Pa and the temperature of the substrate to 750°C. Then, RF sputtering is conducted to form a Pt film 3 on the YSZ layer 2.