Title:
回路基板用積層体およびその製造方法
Document Type and Number:
Japanese Patent JP7327159
Kind Code:
B2
Abstract:
To provide a laminate for circuit board which is excellent in adhesion of a polyimide layer and an aluminum including layer.SOLUTION: A laminate for circuit board comprises: a polyimide layer; and an aluminum-containing layer provided on the polyimide layer. When analysis of a photoelectron spectrum of C1s locus is performed by hard X-ray photoelectron spectroscopy, in a first region including an interface between the polyimide layer and the aluminum including layer, a ratio of integrated strength of a peak having a maximum value in a range of 286.3 eV or greater and 286.6 eV or smaller is 5% or greater with respect to an integrated strength of whole photoelectron spectrum of the C1s locus. When analysis is performed by time-of-flight secondary ion mass spectrometry, in a second region including the interface between the polyimide layer and the aluminum including layer, a count number of Al2O4H fragments is equal to or smaller than 5000.SELECTED DRAWING: Figure 5
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Inventors:
Yuugo Kubo
Application Number:
JP2019238170A
Publication Date:
August 16, 2023
Filing Date:
December 27, 2019
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
B32B15/088; B32B15/20; B32B27/34; H05K1/03; H05K3/00; H05K3/38
Domestic Patent References:
| JP62255145A | ||||
| JP2018027690A | ||||
| JP61195832A | ||||
| JP2018031603A |
Foreign References:
| WO2013150991A1 | ||||
| US6563998 | ||||
| KR1020140041080A |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office