Title:
積層体処理システム及び積層体処理方法
Document Type and Number:
Japanese Patent JP7169834
Kind Code:
B2
Abstract:
To remove a cleaning liquid from a substrate and a holding film after washing to suppress generation of odor and the like from the holding film while suppressing bending of the holding film.SOLUTION: A stacked body plate processing system 1, in which a support 10 and a substrate 40 are stacked via an adhesive layer 30, and a laminated body 50 in which the substrate 40 and a holding film 61 are in close contact with each other is processed, includes: a cleaning device 4 for cleaning the substrate 40 on which the support 10 is peeled off from the laminated body 50 after irradiation of the laminate 50 with light or supply of a solvent with cleaning liquids R1, R2; and a removing device 5 for removing the cleaning liquids R1, R2 adhering to or permeating the substrate 40 and the holding film 61 cleaned by the cleaning device 4.SELECTED DRAWING: Figure 1
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Inventors:
Kimihiro Nakata
Takeshi Yamamoto
Atsushi Miyanari
Takeshi Yamamoto
Atsushi Miyanari
Application Number:
JP2018182384A
Publication Date:
November 11, 2022
Filing Date:
September 27, 2018
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
H01L21/304; H01L21/02; H01L21/683
Domestic Patent References:
| JP2017098474A |
Attorney, Agent or Firm:
Kazuya Nishi