配線基板用積層体及びそのエッチング加工方法

Title:

配線基板用積層体及びそのエッチング加工方法

Document Type and Number:

Japanese Patent JP4271974

Kind Code:

B2

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Inventors:

Wang Hongyuan
Katsufumi Hiraishi

Application Number:

JP2003088715A

Publication Date:

June 03, 2009

Filing Date:

March 27, 2003

Export Citation:

Assignee:

Nippon Steel Chemical Co., Ltd.

International Classes:

B32B15/088; H05K1/03; C08G73/10; H05K3/00

Domestic Patent References:

Attorney, Agent or Firm:

Katsuo Naruse
Tomohiro Nakamura
Eiichi Sano

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