Title:
LAMINATED CHIP INDUCTOR AND METHOD FOR MANUFACTURING THEREOF
Document Type and Number:
Japanese Patent JP2001093733
Kind Code:
A
Abstract:
To provide a laminated chip inductor, which is small-sized and satisfactory in high frequency characteristic, reducible in manufacturing cost, and suitably mounted on a bulk adapative chip, and its manufacturing method.
This inductor is equipped with a coiled internal conductor 10, formed of conductor patterns stacked in stages and a hollow cylinder type external electrode 14, which is connected electrically to an end part of the coiled internal conductor 10.
Inventors:
ICHIKAWA MASABUMI
ARIGA YUKIKO
ARIGA YUKIKO
Application Number:
JP27052099A
Publication Date:
April 06, 2001
Filing Date:
September 24, 1999
Export Citation:
Assignee:
KOA CORP
International Classes:
H01F41/04; H01F17/00; H01F27/29; H01F41/10; (IPC1-7): H01F17/00; H01F27/29; H01F41/04
Attorney, Agent or Firm:
Shintaro Hotta (2 outside)
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