LAMINATED INTEGRATED CIRCUIT - NIPPON TELEGRAPH & TELEPHONE

Title:

LAMINATED INTEGRATED CIRCUIT

Document Type and Number:

Japanese Patent JP2018032680

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To enable high frequency signal transmission between chips without requiring bonding between chips, and the like, and also without requiring a large connection region.SOLUTION: A first transmission line 114 and a second transmission line 124 are arranged in parallel to each other, and the first transmission line 114 and the second transmission line 124 have such a distance therebetween that signals can be coupled. High frequency signals are coupled through a second substrate 102 as a medium between the first transmission line 114 and the second transmission line 124.SELECTED DRAWING: Figure 1

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Inventors:

YAITA MAKOTO
OKADA KENICHI

Application Number:

JP2016162567A

Publication Date:

March 01, 2018

Filing Date:

August 23, 2016

Export Citation:

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Assignee:

NIPPON TELEGRAPH & TELEPHONE
TOKYO INST TECH

International Classes:

H01L25/065; H01L25/07; H01L25/18

Domestic Patent References:

JP2014090203A	2014-05-15
JP2010267666A	2010-11-25
JP2006324563A	2006-11-30
JPH1168033A	1999-03-09
JP2007049422A	2007-02-22

Attorney, Agent or Firm:

Shigeki Yamakawa
Yuzo Koike
Masaki Yamakawa

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