To provide a laminated mounting structure of which the yield is improved, the cost is reduced and the manufacturing time is shortened by miniaturizing the structure so as to reduce the projection area of a substrate in a plane direction, reducing connection resistance and reducing manufacturing processes.
The laminated mounting structure has a plurality of substrates 101a, 101b forming a junction part at least on one main surface and an elastic conductive ball 110 arranged in a gap between electrodes 107a, 107b formed on the opposed substrates 101a, 101b, a through hole 120 is formed on an intermediate substrate 103, and when both the substrates are joined with each other through the junction part 105a or the like, the elastic conductive ball 110 is deformed and buried into the through hole 120 and both the substrates are electrically connected.
KONDO TAKESHI
YASUNAGA SHINJI
