Title:
LAMINATED ELECTRONIC COMPONENT AND MOUNTING BOARD THEREOF
Document Type and Number:
Japanese Patent JP2020004950
Kind Code:
A
Abstract:
To provide a laminated electronic component capable of reducing acoustic noise and high frequency vibration of a laminated capacitor, and to provide a mounting board thereof.SOLUTION: A laminated electronic component comprises a laminated capacitor including a capacitor body and first and second external electrodes formed at both ends thereof, an alumina chip including a chip body and third and fourth external electrodes formed at both ends thereof, where the first and second external terminals are placed in contact with the first and second external electrodes, and a nickel plating layer including a first plating lyer covering the first external electrode and the first external terminals, and a second plating layer covering the second external electrode and the second external terminal, where the first and second plating layers include an external electrode and a nickel plating layer formed on the external terminal, and a tin plating layer formed on the nickel plating layer. A mounting board thereof is also provided.SELECTED DRAWING: Figure 1
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Inventors:
JEONG DAE HEON
YU KYUNG HWA
BYUN MAN SU
CHEONG MIN KYOUNG
SONG SOO-HOWANG
KIM HO YOON
YU KYUNG HWA
BYUN MAN SU
CHEONG MIN KYOUNG
SONG SOO-HOWANG
KIM HO YOON
Application Number:
JP2019067366A
Publication Date:
January 09, 2020
Filing Date:
March 29, 2019
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01G2/02; H01G2/06; H01G4/30; H01G4/38
Domestic Patent References:
| JP2014207422A | 2014-10-30 | |||
| JPH04188813A | 1992-07-07 | |||
| JP2016502273A | 2016-01-21 | |||
| JPS58220492A | 1983-12-22 | |||
| JP2000260661A | 2000-09-22 |
Foreign References:
| US20170169955A1 | 2017-06-15 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation