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Patent Searching and Data


Title:
LAMINATING APPARATUS AND LAMINATING METHOD
Document Type and Number:
Japanese Patent JP2004325547
Kind Code:
A
Abstract:

To simultaneously and parallel laminate a plurality of narrow width half-wave plates 2 onto a substrate 1 without air bubbles to enter in-between employing a simple apparatus.

A substrate 1 is sucked and held on a suction table 16 which is provided on a single axis stage 14 that is arranged in a movable manner along rails 12a and 12b. A rotary table 22 and an elastic roller 21 are arranged on a rotary plate 20 which is provided freely rotatably by a journaling section 19a located on top of a pillar 11 and the half-wave plates 2 are disposed on top of the rotary table 22 and is held, for example, by suction. The sucked half-wave plates 2 are opposed to the substrate 1 at an angle of four degrees for example and the elastic roller 21 is pressed to the substrate 1 side by acting the driving shaft edge of a second air cylinder 23 onto a rotary action piece 19. In such a state, the suction table 16 is moved along the rails 12a and 12b to laminate the substrate 1 and the half-wave plates 2.


Inventors:
HAMAYA HIDEKI
Application Number:
JP2003116799A
Publication Date:
November 18, 2004
Filing Date:
April 22, 2003
Export Citation:
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Assignee:
SONY CORP
International Classes:
G02B7/00; B29C65/78; G02B5/30; G02F1/13363; (IPC1-7): G02B7/00; B29C65/78; G02B5/30; G02F1/13363
Attorney, Agent or Firm:
Tsuyoshi Hashimoto
Hiromichi Kobayashi