Title:
LAMINATION COIL SUBSTRATE AND COIL SUBSTRATE FOR MOTOR
Document Type and Number:
Japanese Patent JP2022052890
Kind Code:
A
Abstract:
To provide a coil substrate having a high space factor.SOLUTION: A lamination coil substrate 120 according to an embodiment consists of: a first coil substrate 31 formed of a first flexible substrate 41, and a first coil C1 formed on the first flexible substrate 41; and a second coil substrate 32 formed of a second flexible substrate 42 laminated on the first coil substrate 31, and a second coil C2 formed on the second flexible substrate 42. The second coil substrate 32 is laminated on the first coil substrate 31 so that the first coil C1 partially overlaps with the second coil C2.SELECTED DRAWING: Figure 6
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Inventors:
MORITA HARUHIKO
MIWA HITOSHI
KATO SHINOBU
YOKOMAKU TOSHIHIKO
KATO HISASHI
HIRASAWA TAKAHISA
MURAKI TETSUYA
FURUNO TAKAYUKI
MIWA HITOSHI
KATO SHINOBU
YOKOMAKU TOSHIHIKO
KATO HISASHI
HIRASAWA TAKAHISA
MURAKI TETSUYA
FURUNO TAKAYUKI
Application Number:
JP2020159402A
Publication Date:
April 05, 2022
Filing Date:
September 24, 2020
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H02K3/04; H01F5/00
Attorney, Agent or Firm:
Akito Tagashita
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