To provide a lamp device 12 defining an appropriate relationship between an LED 56 and a metal cover 32 in use of the LED 56 as a light source.
The lamp device 12 includes the metal cover 32. A base metal 31 is attached to the side of an upper surface of the metal cover 32 and a lighting device 36 is disposed within the base metal 31. A substrate 33 on which chip-shaped LEDs 56 are mounted, a reflector 34 and a light-transmissive cover 35 are disposed on the side of a lower surface of the metal cover 32. The metal cover 32 includes an almost cylindrical form of 80-150 mm in outermost diameter D and 5-25 mm in height h and is in a range of 200-800 mm2/W in 2π(D/2)h/W, that is, an area of the outer peripheral surface per total input power W into the lamp device 12. The total input power W is in a range of 5-20 W.
SHIMIZU KEIICHI
SUWA TAKUMI
SAKAI MAKOTO
OGAWA KOZO
OSAWA SHIGERU
HISAYASU TAKESHI
KONO HITOSHI
| JP2007157690A | 2007-06-21 | |||
| JP2006040727A | 2006-02-09 | |||
| JP2008257993A | 2008-10-23 | |||
| JP2008140606A | 2008-06-19 |
| WO2008146694A1 | 2008-12-04 |
Satoshi Kabazawa
Tetsuya Yamada