To provide a lamp system 12 capable of improving heat radiation performance.
On one surface side of a metallic cover 32, a substrate 33, on which LEDs 56 of a chip shape are mounted, is arranged so as to thermally contact therewith, and a resin transparent cover 35 covering the substrate 33 is fitted thereto. A heat conduction part 47a of a metallic cover side is provided along a peripheral portion of one side of the metallic cover 32. On the transparent cover 35, a heat conduction part 65a of a transparent cover side is provided along the heat conduction part 47a of the metallic cover side so as to be engaged therein to thermally contact therewith. Heat generated by the LEDs 56 is radiated into air from the metallic cover 32 and is efficiently conducted from the metallic cover 32 to the transparent cover 35 to be radiated into air from the transparent cover 35.
SHIMIZU KEIICHI
TANAKA TOSHIYA
SAKAI MAKOTO
OSAWA SHIGERU
HISAYASU TAKESHI
OGAWA KOZO
KONO HITOSHI
| JP2008140606A | 2008-06-19 | |||
| JP2008311237A | 2008-12-25 | |||
| JPH05250905A | 1993-09-28 | |||
| JP2007335258A | 2007-12-27 | |||
| JP2008243615A | 2008-10-09 |
Satoshi Kabazawa
Tetsuya Yamada