Title:
SEMICONDUCTOR DEVICE PROVIDED WITH REPAIR FUSE AND LASER TRIMMING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP3239889
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To lessen fuses in pitch and area occupied by them without causing a short circuit between the adjacent. fuses and damage to a semiconductor device.
SOLUTION: Repair fuses 50 which are each as wide as b and arranged at a pitch in parallel with each other are formed on a semiconductor substrate 1. An opening 5 which enables a laser beam to irradiate each of the fuses 50 is formed so as to cover the fuses 50. The required fuses 50 are each irradiated with a laser beam within an alignment permissible error h, and irradiation regions 60 of diameter d are formed corresponding to the required fuses 50. A laser beam is moved so as to enable the irradiation regions 60 to be virtually arranged in a zigzag. A pitch a is so set as to satisfy a formula, d≥a≥(b+d/24+h), where d, b, and h denote diameter, width, and permissible error, respectively.
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Inventors:
Hideki Fujii
Application Number:
JP2000171334A
Publication Date:
December 17, 2001
Filing Date:
June 07, 2000
Export Citation:
Assignee:
NEC
International Classes:
H01L21/82; H01H85/00; H01H85/044; (IPC1-7): H01L21/82
Domestic Patent References:
| JP7263558A | ||||
| JP6120349A | ||||
| JP917871A |
Attorney, Agent or Firm:
Katsufumi Izumi
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