Title:
LARGE INTEGRATED CIRCUIT WITH MODULAR PROBE SYSTEM, AND ITS TEST METHOD
Document Type and Number:
Japanese Patent JP3883598
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method of design and test of enabling a large integrated circuit, having a die such that the test execution is difficult with a common automatic die probe tester, such as a large scale space light modulator, to be tested with a single die probe tester.
SOLUTION: In a large scale integrated circuit 10 of modular design, each module 12, 14, and 16 is equipped with circuit parts 22, 24, and 34 and pad parts 20 for exclusive use for each. Each circuit module 12, 14, and 16 is functionally tested independently, similar to an independent circuit. The pad 20 for test facilitates the control of an integrated circuit at large, and each module circuit parts 12, 14, and 16 can be tested. This is equipped with a control circuit 26 including a path gate, and when a test is not being performed, the pad part 20 for test of the integrated circuit 10 is separated from operation parts 22, 24, and 34.
Inventors:
Lohit El. Buva
Bao Trang
James L. Connor
Mycle Overlauer
Tracy S. Paulsen
Bao Trang
James L. Connor
Mycle Overlauer
Tracy S. Paulsen
Application Number:
JP31318295A
Publication Date:
February 21, 2007
Filing Date:
November 30, 1995
Export Citation:
Assignee:
Texas Instruments Incorporated
International Classes:
H01L21/66; G01R31/317; G01R31/3185; G02B26/08; G06F11/273; H01L21/822; H01L27/04; (IPC1-7): H01L21/66; H01L27/04; H01L21/822
Domestic Patent References:
| JP5312921A | ||||
| JP8062293A | ||||
| JP5198637A | ||||
| JP2162757A |
Attorney, Agent or Firm:
Hideto Asamura
Hajime Asamura
Hayashi Zouzo
Kuniaki Shimizu
Hajime Asamura
Hayashi Zouzo
Kuniaki Shimizu
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