LASER BEAM FUSION MACHINE

Japanese Patent JP3637719

B2

PROBLEM TO BE SOLVED: To completely attain fusion machining of cutting and separating or the like even in the case of a material to be machined being permeable, and also to unnecessitate the after treatment of the surface of the material to be machined in the stage finished fusion machining and moreover to attain efficient fusion machining of the material to be machined.
SOLUTION: In the laser beam fusion machine executing fusion machining with a YAG laser beam the material 1 to be machined consisting of the thermoplastic resin having high permeability to the wavelength of the beam peculiar to the YAG laser beam, the end part of the heating medium 8 consisting of the metallic material having the same shape as the shape to be fusion machined is brought into close contact with the rear surface of the material 1 to be machined, the material to be machined is irradiated with the YAG laser beam from the opposite side with respect to the heating medium 8, and the heating medium 8 and the YAG laser beam are relatively transferred.

WO/2011/160977	METHOD FOR SLICING A SUBSTRATE WAFER
WO/2011/142464	CUTTING METHOD AND CUTTING DEVICE
WO/2002/094528	DUAL LASER CUTTING OF WAFERS

Yoshihiro Shigehiro

JP3936697A

April 13, 2005

February 24, 1997

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Mitsubishi Electric Corporation

B23K26/40; B23K26/10; B23K26/18; B23K26/32; B23K26/38; B29C65/16; (IPC1-7): B23K26/18; B23K26/10; B23K26/32; B23K26/40; B29C65/16

JP7323384A
JP9029472A
JP3071991A

Shogo Takahashi
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka

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