To provide a laser beam machine and a dam bar machining method capable of simultaneously cutting a dam bar, removing the resin in the dam, and removing the flash without deteriorating the machining efficiency, and capable of completely removing the resin in the dam and the flash.
A semi-conductor IC package of resin-integrated seal type is a work 12, and a dam bar is cut by the laser beam. The laser beam 10 is emitted from a laser beam oscillator 11, the laser beam 10 is split into the laser beam 10A, 10B by a beam splitter 141, the laser beam 10B is formed into the expanding beam using a concave lens 146, and superposed on the laser beam 10A, and the superposed laser beam is passed through a converging lens 145 and the work 12 is irradiated therewith.
NAGANO YOSHIYA
SHIRAI TAKASHI
OKUMURA SHINYA
SHIMOMURA YOSHIAKI
SAKURAI SHIGEYUKI
MINOMOTO YASUSHI
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