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Title:
LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD OF TOOL USING THE SAME
Document Type and Number:
Japanese Patent JP2011121093
Kind Code:
A
Abstract:

To provide a laser beam machining apparatus capable of obtaining high dimensional precision by the laser beam machining corresponding to the movement and the rotating state of a tool or the like, and the laser beam machining method of the tool using the same.

The laser beam machining apparatus for machining a workpiece I by irradiating with a laser beam L includes: a laser beam irradiation mechanism 2 for oscillating the laser beam by the trigger signal to be input and for irradiating the workpiece I with the laser beam; a moving mechanism 4 which holds the workpiece I to a rotary shaft 6a to be moved and rotated, and outputs the moving displacement of a movable stage or the rotational displacement of the rotary shaft 6a as an encoder signal; and a trigger signal generation circuit unit 5 which counts the encoder signal, and outputs the trigger signal to the laser beam irradiation mechanism 2 for each optionally set count number.


Inventors:
TAKAHASHI MASAKUNI
HIGANO SATORU
Application Number:
JP2009281060A
Publication Date:
June 23, 2011
Filing Date:
December 10, 2009
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B23K26/00; B23K26/04; B23K26/08; B23P15/28
Domestic Patent References:
JP2004181494A2004-07-02
JP2002273584A2002-09-25
JP2002273582A2002-09-25
JP2000317660A2000-11-21
Attorney, Agent or Firm:
Hideyuki Sugiura