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Title:
LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD
Document Type and Number:
Japanese Patent JP2011121094
Kind Code:
A
Abstract:

To provide a laser beam machining apparatus and a laser beam machining method for obtaining higher surface precision.

The laser beam machining apparatus includes: a laser beam irradiation mechanism which oscillates a laser beam and irradiates a workpiece with the laser beam at the fixed repetitive frequency, and performs scanning; a movable mechanism for holding and moving the workpiece, and a control unit which controls the laser beam irradiation mechanism to execute the scanning with the laser beam in the circular motion at the fixed speed, controls the moving mechanism to execute machining while moving the workpiece at the fixed moving speed in the specified direction, and sets the position of the laser beam locus group at the time. The control unit executes the machining by shifting the laser beam locus groups several times, and also executes the setting that a portion with non-dense irradiation of the laser beam in one locus group out of the laser beam locus groups with a part thereof overlapped each other and a portion with dense irradiation of the laser beam in the other locus group are superposed on each other.


Inventors:
TAKAHASHI MASAKUNI
HIGANO SATORU
Application Number:
JP2009281061A
Publication Date:
June 23, 2011
Filing Date:
December 10, 2009
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B23K26/08; B23K26/04; B23K26/36; B23K26/40; B23P15/28
Domestic Patent References:
JP2007216327A2007-08-30
JPH08192286A1996-07-30
JPH0538876A1993-02-19
JP2008515643A2008-05-15
Attorney, Agent or Firm:
Hideyuki Sugiura