Title:
LASER BEAM MACHINING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2005095959
Kind Code:
A
Abstract:
To provide a laser beam machining device and method that secure a small bore with high efficiency in the case of forming a through hole in a silicon substrate by laser beam irradiation.
In drilling a silicon substrate by irradiating it with a pulsed laser beam more than one time under a plurality of irradiation conditions, the laser output of the second irradiation condition is made larger than that of the first, thereby enabling a small bore to be efficiently secured by the device and method.
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Inventors:
MIZUTANI YASUHIRO
YOKOHAGI DAISUKE
YOKOHAGI DAISUKE
Application Number:
JP2003335248A
Publication Date:
April 14, 2005
Filing Date:
September 26, 2003
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23K26/00; B23K101/40; (IPC1-7): B23K26/00
Domestic Patent References:
| JPH11267867A | 1999-10-05 | |||
| JPH1197821A | 1999-04-09 | |||
| JPS4896295A | 1973-12-08 | |||
| JP2002018585A | 2002-01-22 |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito
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