To materialize high-quality machining in a laser beam machining device and method.
(a) In a first and a second laser pulse which are made incident on a first and a second machining region respectively, the pulse energy of the first and the second laser pulse divided from the original pulse laser beam along the time-axis is detected using one detector. (b) In the event that the pulse energy of the first laser pulse falls below the lower limit of a tolerance in the machining to be performed in the first machining region, an additional laser pulse is made incident on the incident position of the first laser pulse in the first machining region and, in the event that the pulse energy of the second laser pulse falls below the lower limit of a tolerance in the machining to be performed in the second machining region, an additional laser pulse is made incident on the incident position of the second laser pulse in the second machining region.
Mikio Kuruyama
Ukai Shinichi
Next Patent: COMPACTING DIE, AND SINTERED COMPONENT COMPACTED USING THE SAME