Title:
LASER BEAM MACHINING DEVICE FOR WIRING BOARD
Document Type and Number:
Japanese Patent JP3512624
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent damage to or penetration through the inner layer copper foil of a wiring board, with respect to a laser beam machining device equipped with a transfer optical system that performs drilling of a through-hole or a blind via hole on a wiring board.
SOLUTION: A phase filter 7, which transforms the beam intensity distribution of a laser beam L into a top hat pattern, is provided between a laser generator 1 and a transfer mask 2. As a result, the laser beam L whose intensity distribution has a top hat pattern can be obtained on a machining plane, and generation of damage or penetration on the inner layer copper foil can be avoided, in the case that machining is performed with a laser beam L having a beam intensity distribution close to the Gaussian distribution.
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Inventors:
Matsubara, Masato
Kidokoro, Hitoshi
Kidokoro, Hitoshi
Application Number:
JP6333298A
Publication Date:
March 31, 2004
Filing Date:
March 13, 1998
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K26/382; B23K26/06; B23K26/064; B23K26/066; B23K26/073; G02B27/09; H05K3/00; B23K101/42; (IPC1-7): B23K26/06; B23K26/00; G02B27/09; H05K3/00
Attorney, Agent or Firm:
酒井 宏明 （外１名）
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