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Title:
LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING SYSTEM
Document Type and Number:
Japanese Patent JP2007111754
Kind Code:
A
Abstract:

To provide a laser beam machining method and a laser beam machining system by which laser beam machining grooves can be accurately formed in a plurality of machining areas along a predetermined street formed in a workpiece.

A laser beam machining method which enables the accurate formation of laser beam machining grooves in a plurality of machining areas demarcated along a predetermined street formed in a workpiece includes a machining hole forming process for forming a laser beam machining hole through irradiation with a pulsed laser beam to each start point and end point in a plurality of machining areas demarcated along the street of the workpiece and a machining groove forming process for forming a laser beam machining groove through irradiation with a pulsed laser beam between laser beam machining holes formed in the start point and end point in the machining hole forming process.


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Inventors:
OBA TATSUGO
MORIKAZU YOJI
TSUCHIYA TOSHIO
Application Number:
JP2005307073A
Publication Date:
May 10, 2007
Filing Date:
October 21, 2005
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23K26/00; B23K26/382; B23K26/40; H01L21/301; B23K101/40
Domestic Patent References:
JP2005251882A2005-09-15
JP2004259846A2004-09-16
JPH08195461A1996-07-30
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki



 
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