Title:
LASER MACHINING APPARATUS AND LASER MACHINING METHOD
Document Type and Number:
Japanese Patent JP2010094693
Kind Code:
A
Abstract:
To provide a laser machining apparatus having a monitoring function which does not require a plurality of photodetectors, has the less number of optical components and has a simple configuration.
The laser machining apparatus includes: a laser emitter; a detecting section disposed on an optical axis of the laser emitter; a half mirror disposed between the laser emitter and the detecting section; an optical system for collecting lights from the half mirror; and a casing for holding the laser emitter, the detecting section, the half mirror and the optical system. In the apparatus, a visible light cutoff filter is provided on the detecting surface of the detecting section.
Inventors:
TOOYA KAZUHIRO
MORITA YOHEI
UEDA HIDEJI
MORITA YOHEI
UEDA HIDEJI
Application Number:
JP2008265976A
Publication Date:
April 30, 2010
Filing Date:
October 15, 2008
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
B23K26/00
Domestic Patent References:
| JP2002219593A | 2002-08-06 | |||
| JP2006212689A | 2006-08-17 | |||
| JP2002316291A | 2002-10-29 | |||
| JP2006234920A | 2006-09-07 | |||
| JP2002219593A | 2002-08-06 |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano
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