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Patent Searching and Data


Title:
LASER MACHINING DEVICE
Document Type and Number:
Japanese Patent JP2011173129
Kind Code:
A
Abstract:

To exactly carry out operation of irradiation angle adjustment of a laser beam without requiring complicated operation while safety of a worker is secured.

An optical axis confirmation part 48 including a fluorescent plate 482 through which the laser beam L passes and an imaging part 483 for imaging the fluorescent plate 482 is arranged on the optical axis of the laser beam L, and the laser beam L is irradiated to a wafer (workpiece) 1 while a condenser lens 47 is removed. The irradiation light of the laser beam L passing through the fluorescent plate 482 and reflection light from the wafer 1 emit light at the fluorescent plate 482, and an irradiation angle to a wafer surface is determined to be vertical when a light emitting point is one. The irradiation angle is adjusted by an angle adjusting miller 45 while confirming an image by the imaging part 483 to allow the light emitting point to be one when the light emitting points are two. The laser beam L is shielded by a housing 41 and the emitting state of the fluorescent plate 482 is confirmed by the imaging part 483, so that a light shielding partition or a protecting goggle is not required for the adjustment of the irradiation angle.


Inventors:
ENDO TOMOHIRO
HOSHINO HITOSHI
OBA TATSUGO
FUKUOKA TAKEOMI
AKITA SOICHIRO
Application Number:
JP2010036869A
Publication Date:
September 08, 2011
Filing Date:
February 23, 2010
Export Citation:
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Assignee:
DISCO CORP
International Classes:
B23K26/04
Attorney, Agent or Firm:
Suenari Mikio