To provide laser machining equipment and a laser beam machining method which reduce an unevenness in the number of times of laser image formation within a region to be machined.

A mask 23 for reshaping the cross section of a pulsed laser beam to a slit form is provided with a slit width adjusting mechanism 232 for adjusting the width of the slit 231 formed on the optical path of the pulsed laser beam. A control unit 5 equipped with a microcomputer controls the slit width adjusting mechanism 232 which adjusts the width of the slit 231 so that the width of each laser image formed within the region subjected to the removal of thin films becomes equal to the distance of a wafer W moving after then while the pulsed laser beam is oscillated at N times by a laser beam oscillator 21.