LASER PEENING DEVICE - TOSHIBA CORP

Title:

LASER PEENING DEVICE

Document Type and Number:

Japanese Patent JP2017209709

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To enable execution of laser peening for irradiating the surface even of a limited and narrowed area of a structure with a laser beam and enable impartment of a compressive residual stress on the surface.SOLUTION: The laser peening device includes: a laser irradiation device 21 which has an irradiation head 36 emitting a laser beam, a reflection mirror 42 reflecting the laser beam to the curved surface of a groove part 4 and means for changing the focus position of the laser beam along the surface of the groove part 4, and is movable in a direction to which the groove part 4 is extended; a travel guide table 22 which is detachably fixed to a structure and guides movement of the laser irradiation device 21 in the direction to which the groove extends while keeping the irradiation distance of the laser beam constant; and liquid feeding means for feeding liquid to an area containing a laser focal point on the curved surface of the groove part 4.SELECTED DRAWING: Figure 1

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Inventors:

ARAI MIHA
SENDA ITARU
SASAKI EIJU

Application Number:

JP2016104612A

Publication Date:

November 30, 2017

Filing Date:

May 25, 2016

Export Citation:

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Assignee:

TOSHIBA CORP

International Classes:

B23K26/356; B23K26/08; B23K26/122; F01D5/30; F01D25/00

Domestic Patent References:

JP2005199356A	2005-07-28
JP2007030008A	2007-02-08
JP2010051999A	2010-03-11
JPH11285868A	1999-10-19
JP2011115853A	2011-06-16
JP2004108290A	2004-04-08
JP2017189866A	2017-10-19

Attorney, Agent or Firm:

Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Takeshi Sekine
Kazuya Yamashita

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