Title:
レーザピーニング装置
Document Type and Number:
Japanese Patent JP5118324
Kind Code:
B2
Abstract:
Disclosed is a laser peening apparatus, including: a liquid holding head to shape and hold liquid to trap plasma on a local surface of a workpiece; and a laser irradiation head to irradiate the surface with laser through the liquid held in the liquid holding head.
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Inventors:
Takashi Adachi
Toshimitsu Ogisu
Toshimitsu Ogisu
Application Number:
JP2006270956A
Publication Date:
January 16, 2013
Filing Date:
October 02, 2006
Export Citation:
Assignee:
Fuji Heavy Industries Ltd.
Japan Aerospace Industry Association
Japan Aerospace Industry Association
International Classes:
B23K26/12; B23K26/352; C21D7/04
Domestic Patent References:
| JP11254157A | ||||
| JP2000246468A | ||||
| JP2002346847A | ||||
| JP2003031466A | ||||
| JP2004167590A | ||||
| JP2005272989A | ||||
| JP2006255780A |
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune
Yoshio Arafune
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