Title:
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2017108089
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser processing apparatus and a laser processing method capable of improving the number of wafers to be processed per unit time without increasing acceleration and speed.SOLUTION: A laser processing apparatus includes: a holding unit for holding a plurality of wafers each having a processing region extended at least in one direction side by side in a first direction; a laser irradiation unit for irradiating the plurality of wafers with laser light; a movement mechanism unit for relatively moving the plurality of wafers and the laser irradiation unit in the first direction and a second direction orthogonal to the first direction; an adjustment mechanism unit for arranging respective processing regions of the plurality of wafers on the same straight line parallel to the first direction; and a control unit for performing laser processing of the processing regions by irradiating the processing regions of the plurality of wafers arranged on the same straight line with laser light while relatively moving the plurality of wafers and the laser irradiation unit in the first direction.SELECTED DRAWING: Figure 1
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Inventors:
ICHISUHO NAOSATO
Application Number:
JP2015245046A
Publication Date:
June 15, 2017
Filing Date:
December 16, 2015
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
H01L21/301; B23K26/02; B23K26/03; B23K26/046; B23K26/70; H01L21/68
Attorney, Agent or Firm:
Kenzo Matsuura
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