Title:
LASER PROCESSING DEVICE, AND FOCUS POINT POSITION CORRECTION METHOD
Document Type and Number:
Japanese Patent JP2022041266
Kind Code:
A
Abstract:
To provide a new laser processing device which corrects deviation of a focus point position by an influence of thermal expansion accompanied by heat generation of a movement mechanism in view of the influence of the thermal expansion, and can improve a processing quality.SOLUTION: A laser processing device 10 further has a temperature detector 36 for detecting a temperature of a holding mechanism 37 or a temperature of a driving part for moving the holding mechanism 37 in a processing feed direction in a movement mechanism 14, a laser beam irradiation mechanism 12 has a focus point position adjustment unit for adjusting a focus point position of a laser beam in a thickness direction of workpiece W, and a controller 100 controls the focus point position adjustment unit according to a change of a temperature detected by the temperature detector 36 and sets the focus point position of the laser beam in the thickness direction of the workpiece W, controls the driving part and sets a position of the workpiece W of the focus point in an indexing feed direction, and thereby corrects the focus point position of the laser beam.SELECTED DRAWING: Figure 1
Inventors:
ODANAKA KENTARO
Application Number:
JP2020146368A
Publication Date:
March 11, 2022
Filing Date:
August 31, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23K26/00; B23K26/046; H01L21/301
Attorney, Agent or Firm:
Hiroshi Ogami
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