Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR UNIT
Document Type and Number:
Japanese Patent JP2022041267
Kind Code:
A
Abstract:
To electrically connect a semiconductor device and an integrated circuit while suppressing the increase in inductance.SOLUTION: A semiconductor device 1A has a substrate 10, a semiconductor element 40 mounted on the substrate 10, an integrated circuit 20 formed inside the substrate 10, and a control communication wiring 32B provided inside the substrate 10 and electrically connecting the semiconductor element 40 and the integrated circuit 20.SELECTED DRAWING: Figure 3
Inventors:
NAKAYA GORO
TADA YOSHIHIRO
YAMAMOTO ISAO
TADA YOSHIHIRO
YAMAMOTO ISAO
Application Number:
JP2020146369A
Publication Date:
March 11, 2022
Filing Date:
August 31, 2020
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L33/62; F21V23/00; H01L25/00; H01L25/10; H01L31/12; H01L33/00; H01S5/022; H05B45/12; H05B47/17; H05B47/18
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda