Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2023108397
Kind Code:
A
Abstract:
To provide a laser processing device and a laser processing method that branch laser light and irradiate an object with the laser light, which can appropriately form a first groove and a second groove along a line on the object.SOLUTION: A laser processing device 1 comprises a support part 2, a laser light source 31, a spatial light modulator 132 and a light condensing part 34. A modulation pattern that is displayed on a display part 132A of the spatial light modulator 132 includes a branching pattern in which laser light L is branched into first branched laser light LA for forming a first groove M1 and second branched light LB for forming a second groove M2. An interval d23 between a position of a light condensing point SA2 of the first branched laser light LA and a position of a light condensing point SB1 of the second branched laser light LB in a direction along a line 15 is larger than and interval Y1 between the position of the light condensing point SA2 of the first branched laser light LA and the position of the light condensing point SB1 of the second branched laser light LB, in a width direction.SELECTED DRAWING: Figure 6
Inventors:
SAKAMOTO TSUYOSHI
SUGIMOTO AKIRA
OGIWARA TAKAFUMI
KURITA TAKASHI
YOSHIMURA RYO
SUGIMOTO AKIRA
OGIWARA TAKAFUMI
KURITA TAKASHI
YOSHIMURA RYO
Application Number:
JP2022009499A
Publication Date:
August 04, 2023
Filing Date:
January 25, 2022
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK
International Classes:
B23K26/364; B23K26/064; B23K26/067; H01L21/301
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Kenichi Shibayama
Toshio Arai
Yoshiki Kuroki
Kenichi Shibayama
Toshio Arai