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Title:
LASER PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2012223772
Kind Code:
A
Abstract:

To provide a laser processing device that can avoid the influence of the matters scattered from a workpiece, thereby accurately detecting a position of a laser beam relative to a processing nozzle.

The laser processing device includes: a processing head 5 having a hollow housing; a processing lens 4 provided inside the processing head 5 and condensing the laser beam 2 to irradiate the laser beam toward the workpiece W; the processing nozzle 11 provided at an end of the processing head 5 and feeding an assist gas along a traveling direction of the condensed laser beam 2; and an optical sensor 6 provided inside the processing head 5 and receiving the light generated in a processed part of the workpiece via the processing lens 4. The optical sensor 6 is disposed so as to receive the light reflected once or more times at one or both of the inner surfaces of the processing nozzle 11 and the processing head 5, out of the light generated in the processed part of the workpiece W.


Inventors:
MATSUZAWA SUGURU
KONO HIROYUKI
SEGUCHI MASAKI
FUKUOKA TERUAKI
Application Number:
JP2011090556A
Publication Date:
November 15, 2012
Filing Date:
April 15, 2011
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K26/00; B23K26/042; B23K26/064; B23K26/14
Domestic Patent References:
JPH10249566A1998-09-22
JPH10249572A1998-09-22
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Mikio Takeuchi