To provide an apparatus for manufacturing a semiconductor device, which can prevent such a problem that operation of the manufacturing apparatus is interrupted and a problem that the semiconductor device falls in a mold and is broken as a result of the semiconductor device being lifted while being attached to a punch guide.

As shown in Fig.1, the manufacturing apparatus has: a die 90 which holds the semiconductor device having a lead 110; a punch 10 which pinches the lead 110 with an external face of the die 90; a punch guide 40 which guides the punch 10 and pinches a portion which is not molded by the punch 10 in the lead 110 with the die 90; a lifting means 80 which lifts the punch guide 40; and a controlling means 130 which controls the lifting means 80 that lifts the punch guide 40 while the die 90 and the punch 10 pinches and fixes a base of the lead 110.