Title:
LASER PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2016132017
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser processing device for further enhancing processing efficiency.SOLUTION: A laser processing device comprises holding means (6) for holding a workpiece (11), laser irradiation means (30) for irradiating a laser beam (L), processing feed means (8) for relatively moving the holding means and the laser irradiation means in a processing feed direction, indexing feed means (8) for relatively moving the holding means and the laser irradiation means in an indexing feed direction and control means (44) for controlling movements of respective parts, and the control means simultaneously starts a stopping step and an indexing step when being tb>ta, assuming time required for the stopping step of stopping the laser irradiation means to the holding means as ta and time required for the indexing step of adjusting an irradiation position of the laser beam to the next division expected line as tb, and executes a starting step of accelerating the laser irradiation means to the holding means by using a residual time (tb-ta) of the indexing step after finishing the stopping step.SELECTED DRAWING: Figure 1
Inventors:
SANPEI TAKASHI
Application Number:
JP2015009273A
Publication Date:
July 25, 2016
Filing Date:
January 21, 2015
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23K26/00; B23K26/351
Domestic Patent References:
| JP2012161799A | 2012-08-30 | |||
| JP2008042032A | 2008-02-21 | |||
| JP2000106340A | 2000-04-11 |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Tomohiro Okamoto
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