Title:
レーザ加工装置及びレーザ加工方法
Document Type and Number:
Japanese Patent JP7391645
Kind Code:
B2
Abstract:
To provide a laser processing device and a laser processing method that can relax gap management between members and can improve the yield of processing.SOLUTION: A laser processing device 1 joins a first light transmissive member S1 and a second light transmissive member S2 together through irradiation with laser light, and comprises; a light irradiation part 3 which emits pulsed laser light L1 through the second light transmissive member S2 such that a focusing point P is located inside the first light transmissive member S1; and an optical scanning part 4 which makes a scan with the pulsed laser light L1 along a joining predetermined line W between the first light transmissive member S1 and second light transmissive member S2, the pulsed laser light L2 being in a long-sized shape along the joining predetermined line W in at least a part of a region from an incidence-side surface Sc of the first light transmissive member S1 for the pulsed laser light L2 to the focusing point P when viewed from an incidence direction of the pulsed laser light L2 to the first light transmissive member S1.SELECTED DRAWING: Figure 1
Inventors:
Akira Takeda
Fukuoka Otake
Fukuoka Otake
Application Number:
JP2019222194A
Publication Date:
December 05, 2023
Filing Date:
December 09, 2019
Export Citation:
Assignee:
Hamamatsu Photonics K.K.
International Classes:
B23K26/53; C03B23/203; H01S3/00; H01S3/10
Domestic Patent References:
| JP2008062263A | ||||
| JP2012527356A |
Foreign References:
| US20130344302 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Kenichi Shibayama
Hiromitsu Nakayama
Yoshiki Kuroki
Kenichi Shibayama
Hiromitsu Nakayama