Title:
電線対導電性金属板のレーザ溶接構造
Document Type and Number:
Japanese Patent JP5466194
Kind Code:
B2
Abstract:
A laser welding structure that is formed by joining a stranded wire (wire) of a signal line and a welding portion (conductive metal plate) by locally applying a laser beam and thereby melting and solidifying the stranded wire of the signal line and the welding portion has the following features. That is, the melting point of the stranded wire of the signal line and the melting point of the welding portion are different. The laser welding structure is obtained by applying a laser beam to one of the stranded wire of the signal line and the welding portion that has a higher melting point, i.e., to the welding portion having a higher melting point.
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Inventors:
Takushi Yoshida
Inudo Tomoki
Hiroshi Akimoto
Inudo Tomoki
Hiroshi Akimoto
Application Number:
JP2011056454A
Publication Date:
April 09, 2014
Filing Date:
March 15, 2011
Export Citation:
Assignee:
Japan Aviation Electronics Industry Co., Ltd.
International Classes:
B23K26/00; B23K26/21; H01R43/02
Domestic Patent References:
| JP4089190A | ||||
| JP2004192948A |
Attorney, Agent or Firm:
Ken Ieiri
Shinsuke Ozeki
Yasuhiro Iwase
Seki Kyogo
Shinsuke Ozeki
Yasuhiro Iwase
Seki Kyogo